Endut, Z. (2017). Effect of moisture on underfill interfacial adhesion and packages flexural strength in flip chip packaging.
استشهاد بنمط شيكاغوEndut, Z. Effect of Moisture On Underfill Interfacial Adhesion and Packages Flexural Strength in Flip Chip Packaging. 2017.
MLA استشهادEndut, Z. Effect of Moisture On Underfill Interfacial Adhesion and Packages Flexural Strength in Flip Chip Packaging. 2017.
تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.