Sayyidah Amnah, M., & Norainiza, S. (2015). Development of Sn-Cu filled activated carbon composite solder via powder metallurgy technique. Universiti Malaysia Perlis (UniMAP).
Chicago Style CitationSayyidah Amnah, Musa, and Saud Norainiza. Development of Sn-Cu Filled Activated Carbon Composite Solder Via Powder Metallurgy Technique. Universiti Malaysia Perlis (UniMAP), 2015.
MLA CitationSayyidah Amnah, Musa, and Saud Norainiza. Development of Sn-Cu Filled Activated Carbon Composite Solder Via Powder Metallurgy Technique. Universiti Malaysia Perlis (UniMAP), 2015.
Warning: These citations may not always be 100% accurate.