APA引文

Teh Pei Leng, D. (2014). Epoxy -recycled copper (e-recop) as thermoforming mold materials. Universiti Malaysia Perlis (UniMAP).

Chicago Style Citation

Teh Pei Leng, Dr. Epoxy -recycled Copper (e-recop) As Thermoforming Mold Materials. Universiti Malaysia Perlis (UniMAP), 2014.

MLA引文

Teh Pei Leng, Dr. Epoxy -recycled Copper (e-recop) As Thermoforming Mold Materials. Universiti Malaysia Perlis (UniMAP), 2014.

警告：這些引文格式不一定是100％准確.