APA引用形式

Teh Pei Leng, D. (2014). Epoxy -recycled copper (e-recop) as thermoforming mold materials. Universiti Malaysia Perlis (UniMAP).

シカゴスタイル引用形

Teh Pei Leng, Dr. Epoxy -recycled Copper (e-recop) As Thermoforming Mold Materials. Universiti Malaysia Perlis (UniMAP), 2014.

MLA引用形式

Teh Pei Leng, Dr. Epoxy -recycled Copper (e-recop) As Thermoforming Mold Materials. Universiti Malaysia Perlis (UniMAP), 2014.

警告: この引用は必ずしも正確ではありません.