Teh Pei Leng, D. (2014). Epoxy -recycled copper (e-recop) as thermoforming mold materials. Universiti Malaysia Perlis (UniMAP).
استشهاد بنمط شيكاغوTeh Pei Leng, Dr. Epoxy -recycled Copper (e-recop) As Thermoforming Mold Materials. Universiti Malaysia Perlis (UniMAP), 2014.
MLA استشهادTeh Pei Leng, Dr. Epoxy -recycled Copper (e-recop) As Thermoforming Mold Materials. Universiti Malaysia Perlis (UniMAP), 2014.
تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.