Jeevan, K., & gaquadir@unimap.edu.my. (2014). Thermal management of multi-chip module and printed circuit board using FEM and genetic algorithms. Emerald Group Publishing Limited.
استشهاد بنمط شيكاغوJeevan, Kanesan, and gaquadir@unimap.edu.my. Thermal Management of Multi-chip Module and Printed Circuit Board Using FEM and Genetic Algorithms. Emerald Group Publishing Limited, 2014.
MLA استشهادJeevan, Kanesan, and gaquadir@unimap.edu.my. Thermal Management of Multi-chip Module and Printed Circuit Board Using FEM and Genetic Algorithms. Emerald Group Publishing Limited, 2014.
تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.