Chong, L. G., & clgan_pgg@yahoo.com. (2014). Wearout reliability and intermetallic compound diffusion kinetics of Au and PdCu wires used in nanoscale device packaging. Hindawi Publishing Corporation.
シカゴスタイル引用形Chong, Leong Gan, and clgan_pgg@yahoo.com. Wearout Reliability and Intermetallic Compound Diffusion Kinetics of Au and PdCu Wires Used in Nanoscale Device Packaging. Hindawi Publishing Corporation, 2014.
MLA引用形式Chong, Leong Gan, and clgan_pgg@yahoo.com. Wearout Reliability and Intermetallic Compound Diffusion Kinetics of Au and PdCu Wires Used in Nanoscale Device Packaging. Hindawi Publishing Corporation, 2014.
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