APA引文

C., L. G., & pgg@yahoo.com, c. (2013). Technical barriers and development of Cu wirebonding in nanoelectronics device packaging. Hindawi Publishing Corporation.

Chicago Style Citation

C., L. Gan, and clgan pgg@yahoo.com. Technical Barriers and Development of Cu Wirebonding in Nanoelectronics Device Packaging. Hindawi Publishing Corporation, 2013.

MLA引文

C., L. Gan, and clgan pgg@yahoo.com. Technical Barriers and Development of Cu Wirebonding in Nanoelectronics Device Packaging. Hindawi Publishing Corporation, 2013.

警告：这些引文格式不一定是100％准确.