C., L. G., & pgg@yahoo.com, c. (2013). Technical barriers and development of Cu wirebonding in nanoelectronics device packaging. Hindawi Publishing Corporation.
シカゴスタイル引用形C., L. Gan, and clgan pgg@yahoo.com. Technical Barriers and Development of Cu Wirebonding in Nanoelectronics Device Packaging. Hindawi Publishing Corporation, 2013.
MLA引用形式C., L. Gan, and clgan pgg@yahoo.com. Technical Barriers and Development of Cu Wirebonding in Nanoelectronics Device Packaging. Hindawi Publishing Corporation, 2013.
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