Lee, H. (2021). Feasibility Study of Wafer Scale Laser Assisted Thermal Imprinting of Glass Nanostructures. Springer, Singapore.
استشهاد بنمط شيكاغوLee, Helen. Feasibility Study of Wafer Scale Laser Assisted Thermal Imprinting of Glass Nanostructures. Springer, Singapore, 2021.
MLA استشهادLee, Helen. Feasibility Study of Wafer Scale Laser Assisted Thermal Imprinting of Glass Nanostructures. Springer, Singapore, 2021.
تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.