Search Results - all grid array package

Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology by Kar Y.B., Talik N.A., Sauli Z., Seng F.C., Yong T.C., Retnasamy V.

“…Purpose - This paper aims to discuss the effects of ionic contaminations on the die surface of high lead flip chip ball grid array (FCBGA) package. Ionic contaminations from the flux residue, formed during the die attachment process, could affect the package long-term performance. …”

A practical investigation on nickel plated copper heat spreader with different catalytic activation processes for flip-chip ball grid array packages by Amin N., Lim V., Seng F.C., Razid R., Ahmad I.

Comparison study on reliability performance for polymer core solder balls under multiple reflow and HTS stress tests by Kar Y.B., Hui T.C., Agileswari R., Lo C.

“…Drop ball reliability for Ball Grid Array (BGA) package on lead-free product is a major reliability concern. …”

Mechanical properties study of lead free solder joint material used in semiconductor packaging subjected to thermal condition by Harif M.N., Ahmad I.

“…The effect of high temperature storage (HTS) on lead free solder joint material for ball grid array application using pull test method were studied in this paper. …”

Investigation Of Wire Sweep During Pbga Encapsulation Process Using Fluid Structure Interaction by Ramdan, Dadan

“…In this research, visualization of wire sweep phenomenon during the encapsulation process of plastic ball grid array (PBGA) package is studied through a three-dimensional (3D) fluid structure interaction (FSI) technique; which FV- and FE-based software are connected by using mesh-based parallel code coupling interface (MpCCI). …”
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Lead free solder joint thermal condition in semiconductor packaging by Harif, Muhammad Najib, Nadzri, Allina, Jusoff, Kamaruzaman

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