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Transient electromagnetic-thermal nondestructive testing by He, Yunze, Gao, Bin, Sophian, Ali, Yang, Ruizhen

“…In addition, the book explores methods, such as time domain, frequency domain and logarithm domain, also comparing A-scan , B-scan and C-scan. Sections on defect identification, classification and quantification are covered, as are advanced algorithms, principal components analysis (PCA), independent components analysis (ICA) and support vector machine (SVM). …”
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