Search Results - "Ball grid array package"

Heat Transfer And Deformation Of Flexible Printed Circuit Board With Multi Ball Grid Array Packages by Lim, Chong Hooi

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Curing profile optimization of silver epoxy die attach in ball grid array package process / Ng Qian Qing by Ng , Qian Qing

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Temperature cycling analysis for ball grid array package using finite element analysis by Muhammad Nubli, Zulkifli, Zul Azhar, Zahid Jamal, Prof. Dr., Ghulam, Abdul Quadir

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A practical investigation on nickel plated copper heat spreader with different catalytic activation processes for flip-chip ball grid array packages by Amin N., Lim V., Seng F.C., Razid R., Ahmad I.

Thermal fluid-structure interaction analysis on flexible printed circuit board during reflow soldering. by Muhammad Iqbal Ahmad

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Characterization of nickel plated copper heat spreaders with different catalytic activation processes for flip-chip ball grid array package by Lim V., Ahmad I., Seng F.C., Amin N., Rasid R.

Optimization of novel two-step curing method for die stack epoxy bonding to reduce voids in Ball Grid Array packages for high-density interconnect applications by Ng Q.Q., Tan C.Y., Wong Y.H., Yap B.K., Yusof F.B., Saher S.

Comparison study on reliability performance for polymer core solder balls under multiple reflow and HTS stress tests by Kar Y.B., Hui T.C., Agileswari R., Lo C.

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