Search Results - "Ball grid array"

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  1. 1
    Finite Element Analysis On The Effect Of Solder Joint Geometry For The Reliability Of Ball Grid Array Assembly With Flexible And Rigid PCBS

    Finite Element Analysis On The Effect Of Solder Joint Geometry For The Reliability Of Ball Grid Array Assembly With Flexible And Rigid PCBS by Lau, Chun Sean, Abdullah, M. Z., Mujeebu, M. Abdul, Yusof, N. Md

    Published 2014
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  2. 2
    Application of statistical methods to reduce the defect of assembly process for plastic ball grid array (PBGA) component

    Application of statistical methods to reduce the defect of assembly process for plastic ball grid array (PBGA) component by Tan, Chun Huat

    Published 2014
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  3. 3
    Heat Transfer And Deformation Of Flexible Printed Circuit Board With Multi Ball Grid Array Packages

    Heat Transfer And Deformation Of Flexible Printed Circuit Board With Multi Ball Grid Array Packages by Lim, Chong Hooi

    Published 2017
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  4. 4
    Determination of thermal expansion coefficient for ball grid array using digital image correlation

    Determination of thermal expansion coefficient for ball grid array using digital image correlation by Kong, Yat Sheng, Crosbie, Liam

    Published 2022
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  5. 5
    Optimization of novel two-step curing method for die stack epoxy bonding to reduce voids in Ball Grid Array packages for high-density interconnect applications

    Optimization of novel two-step curing method for die stack epoxy bonding to reduce voids in Ball Grid Array packages for high-density interconnect applications by Ng Q.Q., Tan C.Y., Wong Y.H., Yap B.K., Yusof F.B., Saher S.

    Published 2025
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  6. 6
    Curing profile optimization of silver epoxy die attach in ball grid array package process / Ng Qian Qing

    Curing profile optimization of silver epoxy die attach in ball grid array package process / Ng Qian Qing by Ng , Qian Qing

    Published 2024
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  7. 7
    Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA)

    Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA) by Muhammad Nubli, Zulkifli

    Published 2010
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  8. 8
    Temperature cycling analysis for ball grid array package using finite element analysis

    Temperature cycling analysis for ball grid array package using finite element analysis by Muhammad Nubli, Zulkifli, Zul Azhar, Zahid Jamal, Prof. Dr., Ghulam, Abdul Quadir

    Published 2011
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  9. 9
    Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology

    Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology by Kar Y.B., Talik N.A., Sauli Z., Seng F.C., Yong T.C., Retnasamy V.

    Published 2023
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  10. 10
    Effect of reflow soldering process on metallurgical bonding between Sn3.5Ag solder and ENIG substrates

    Effect of reflow soldering process on metallurgical bonding between Sn3.5Ag solder and ENIG substrates by Muhammad N.A., Bais B.H., Ahmad I., Isnin A.

    Published 2023
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  11. 11
    A practical investigation on nickel plated copper heat spreader with different catalytic activation processes for flip-chip ball grid array packages

    A practical investigation on nickel plated copper heat spreader with different catalytic activation processes for flip-chip ball grid array packages by Amin N., Lim V., Seng F.C., Razid R., Ahmad I.

    Published 2023
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  12. 12
    Characterization of nickel plated copper heat spreaders with different catalytic activation processes for flip-chip ball grid array package

    Characterization of nickel plated copper heat spreaders with different catalytic activation processes for flip-chip ball grid array package by Lim V., Ahmad I., Seng F.C., Amin N., Rasid R.

    Published 2023
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  13. 13
    Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS

    Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS by Kar Y.B., Talik N.A., Sauli Z., Fei J.S., Retnasamy V.

    Published 2023
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  14. 14
    Comparison study on reliability performance for polymer core solder balls under multiple reflow and HTS stress tests

    Comparison study on reliability performance for polymer core solder balls under multiple reflow and HTS stress tests by Kar Y.B., Hui T.C., Agileswari R., Lo C.

    Published 2023
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  15. 15
    Characterization study for polymer core solder balls under AC and TC reliability test

    Characterization study for polymer core solder balls under AC and TC reliability test by Tan C.H., Yap B.K., Tan C.Y.

    Published 2023
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  16. 16
    Detecting head in pillow defect (HIP) by using deep learning and image processing technique

    Detecting head in pillow defect (HIP) by using deep learning and image processing technique by Tan, Wei Jin

    Published 2021
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    Final Year Project / Dissertation / Thesis
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  17. 17
    Determination Of Fracture Toughness In PBGA Packages Using Finite Element And Experimental Methods

    Determination Of Fracture Toughness In PBGA Packages Using Finite Element And Experimental Methods by Tan, Chew Pheng

    Published 2006
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  18. 18
    Study of interfacial reactions between lead-free solders and immersion silver finish

    Study of interfacial reactions between lead-free solders and immersion silver finish by Oshaghi, Safoura

    Published 2008
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  19. 19
    Thermal fluid-structure interaction analysis on flexible printed circuit board during reflow soldering.

    Thermal fluid-structure interaction analysis on flexible printed circuit board during reflow soldering. by Muhammad Iqbal Ahmad

    Published 2021
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    UMK Etheses
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  20. 20
    Warpage Behavior Of Thin Fcbga Package And Prediction Of Its First Interconnect Snag Solder Joint Shape

    Warpage Behavior Of Thin Fcbga Package And Prediction Of Its First Interconnect Snag Solder Joint Shape by Lim, Shaw Fa

    Published 2020
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