Numerical Simulation Of Self-Alignment Of Chip Resistor Components For Different Silver Content During Reflow Soldering

Three-dimensional simulation and experimental investigation of self-alignment phenomena during the reflow soldering process were presented. The multiphase flow model was developed using ANSYS Fluent to investigate the self-alignment effect of laminar melted lead-free solder during the reflow phase o...

Full description

Bibliographic Details

Main Authors:	Abdullah, Mohd Zulkifly, Ali Mokhtar, Mohd Najib, Saad, Abdullah Aziz, Samsudin, Zambri, Che Ani, Fakhrozi
Format:	Article
Language:	en
Published:	Elsevier Ltd. 2017
Online Access:	http://eprints.utem.edu.my/id/eprint/22722/2/MR%20journal%202017.pdf http://eprints.utem.edu.my/id/eprint/22722/ https://www.sciencedirect.com/science/article/pii/S0026271417304870
Tags:	Add Tag No Tags, Be the first to tag this record!