Stitch Bonding Strength of Cu Wire on AuAg/Pd/Ni Preplated Cu Leadframes: Influence of AuAg Thickness

Copper (Cu) wire bonding on the pre-plated leadframes with Ni/Pd/AuAg plating has been applied extensively in the semiconductor industry for the interconnection of integrated-circuit (IC) packaging due to the lower material cost of Cu and its excellent electrical properties. Furthermore, the Cu wir...

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Bibliographic Details

Main Authors:	Tey, Sock Chien, Lau, Kok Tee, Mohamad Noor, Mohd Hafizul, Tham, Yon Loong, Abd Manaf, Mohd Edeerozey
Format:	Article
Language:	en
Published:	Trans Tech Publications 2015
Subjects:	TK Electrical engineering. Electronics Nuclear engineering TS Manufactures
Online Access:	http://eprints.utem.edu.my/id/eprint/17769/1/AMM.761.364%20%281%29.pdf http://eprints.utem.edu.my/id/eprint/17769/ http://www.scientific.net/AMM
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