APA (7th ed.) Citation

M.N, Z., I, A., N.H, A., A, J., & 36703431600. (2025). Micromechanical and microstructure evolution of leaded (SnPb) and lead-free (SAC305 and SnCu) mixed solder joints during isothermal aging. Taylor and Francis Ltd.

Chicago Style (17th ed.) Citation

M.N, Zulkifli, Abdullah I, Azhan N.H, Jalar A, and 36703431600. Micromechanical and Microstructure Evolution of Leaded (SnPb) and Lead-free (SAC305 and SnCu) Mixed Solder Joints During Isothermal Aging. Taylor and Francis Ltd, 2025.

MLA (9th ed.) Citation

M.N, Zulkifli, et al. Micromechanical and Microstructure Evolution of Leaded (SnPb) and Lead-free (SAC305 and SnCu) Mixed Solder Joints During Isothermal Aging. Taylor and Francis Ltd, 2025.