Optimization of novel two-step curing method for die stack epoxy bonding to reduce voids in Ball Grid Array packages for high-density interconnect applications

Optimization of novel two-step curing method for die stack epoxy bonding to reduce voids in Ball Grid Array packages for high-density interconnect applications

This research explores the optimization of epoxy curing parameters to minimize void formation in 3-IC-Chip-MAPBGA packages, a subset of BGA packages, crucial components in high-density interconnect applications. The study utilizes a systematic approach involving design of experiments (DOE) assisted...

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Bibliographic Details
Main Authors: Ng Q.Q., Tan C.Y., Wong Y.H., Yap B.K., Yusof F.B., Saher S.
Other Authors: 59185580100
Format: Article
Published: Elsevier Ltd 2025
Subjects:
Curing
Design of experiments
Dies
Differential scanning calorimetry
Electronics packaging
Integrated circuit interconnects
Thermogravimetric analysis
% reductions
Ball grid array
Ball-grid arrays
Curing profile
Epoxy
High density interconnects
Interconnect applications
Optimisations
Shears strength
Voids formation
Ball grid arrays
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