Optimization of novel two-step curing method for die stack epoxy bonding to reduce voids in Ball Grid Array packages for high-density interconnect applications
This research explores the optimization of epoxy curing parameters to minimize void formation in 3-IC-Chip-MAPBGA packages, a subset of BGA packages, crucial components in high-density interconnect applications. The study utilizes a systematic approach involving design of experiments (DOE) assisted...
Saved in:
| Main Authors: | , , , , , |
|---|---|
| Other Authors: | |
| Format: | Article |
| Published: |
Elsevier Ltd
2025
|
| Subjects: | |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|