APA (7th ed.) Citation

Q.Q, N., C.Y, T., Y.H, W., B.K, Y., F.B, Y., S, S., & 59185580100. (2025). Optimization of novel two-step curing method for die stack epoxy bonding to reduce voids in Ball Grid Array packages for high-density interconnect applications. Elsevier Ltd.

Chicago Style (17th ed.) Citation

Q.Q, Ng, Tan C.Y, Wong Y.H, Yap B.K, Yusof F.B, Saher S, and 59185580100. Optimization of Novel Two-step Curing Method for Die Stack Epoxy Bonding to Reduce Voids in Ball Grid Array Packages for High-density Interconnect Applications. Elsevier Ltd, 2025.

MLA (9th ed.) Citation

Q.Q, Ng, et al. Optimization of Novel Two-step Curing Method for Die Stack Epoxy Bonding to Reduce Voids in Ball Grid Array Packages for High-density Interconnect Applications. Elsevier Ltd, 2025.