W.Z.Z.W, Z., T.C, Y., T.C, H., Y.B, K., W.Y, H., & 58072690400. (2024). Optimization of reflow profile for copper pillar with SAC305 solder cap FCCSP. Springer.
Chicago Style (17th ed.) CitationW.Z.Z.W, Zainudin, Yong T.C, Hui T.C, Kar Y.B, Hoong W.Y, and 58072690400. Optimization of Reflow Profile for Copper Pillar with SAC305 Solder Cap FCCSP. Springer, 2024.
MLA (9th ed.) CitationW.Z.Z.W, Zainudin, et al. Optimization of Reflow Profile for Copper Pillar with SAC305 Solder Cap FCCSP. Springer, 2024.
Warning: These citations may not always be 100% accurate.
