APA (7th ed.) Citation

T.T, D., M.N.M, A., M.A, A. H., A.A, O., O.J, O., A, A., & 56225674500. (2024). Recent advances in Sn-based lead-free solder interconnects for microelectronics packaging: Materials and technologies. Elsevier Editora Ltda.

Chicago Style (17th ed.) Citation

T.T, Dele-Afolabi, Ansari M.N.M, Azmah Hanim M.A, Oyekanmi A.A, Ojo-Kupoluyi O.J, Atiqah A, and 56225674500. Recent Advances in Sn-based Lead-free Solder Interconnects for Microelectronics Packaging: Materials and Technologies. Elsevier Editora Ltda, 2024.

MLA (9th ed.) Citation

T.T, Dele-Afolabi, et al. Recent Advances in Sn-based Lead-free Solder Interconnects for Microelectronics Packaging: Materials and Technologies. Elsevier Editora Ltda, 2024.