APA (7th ed.) Citation

N, A., A.Y, C., Z, K., I, A., & 7102424614. (2023). The effect of clean and no-clean flux in enhancing the wettability of eutectic solder bump flip chip PBGA.

Chicago Style (17th ed.) Citation

N, Amin, Cheah A.Y, Kornain Z, Ahmad I, and 7102424614. The Effect of Clean and No-clean Flux in Enhancing the Wettability of Eutectic Solder Bump Flip Chip PBGA. 2023.

MLA (9th ed.) Citation

N, Amin, et al. The Effect of Clean and No-clean Flux in Enhancing the Wettability of Eutectic Solder Bump Flip Chip PBGA. 2023.