APA (7th ed.) Citation

N, A., V, L., F.C, S., R, R., I, A., & 7102424614. (2023). A practical investigation on nickel plated copper heat spreader with different catalytic activation processes for flip-chip ball grid array packages.

Chicago Style (17th ed.) Citation

N, Amin, Lim V, Seng F.C, Razid R, Ahmad I, and 7102424614. A Practical Investigation on Nickel Plated Copper Heat Spreader with Different Catalytic Activation Processes for Flip-chip Ball Grid Array Packages. 2023.

MLA (9th ed.) Citation

N, Amin, et al. A Practical Investigation on Nickel Plated Copper Heat Spreader with Different Catalytic Activation Processes for Flip-chip Ball Grid Array Packages. 2023.