APA (7th ed.) Citation

V, L., I, A., F.C, S., N, A., R, R., & 26432767800. (2023). Characterization of nickel plated copper heat spreaders with different catalytic activation processes for flip-chip ball grid array package.

Chicago Style (17th ed.) Citation

V, Lim, Ahmad I, Seng F.C, Amin N, Rasid R, and 26432767800. Characterization of Nickel Plated Copper Heat Spreaders with Different Catalytic Activation Processes for Flip-chip Ball Grid Array Package. 2023.

MLA (9th ed.) Citation

V, Lim, et al. Characterization of Nickel Plated Copper Heat Spreaders with Different Catalytic Activation Processes for Flip-chip Ball Grid Array Package. 2023.