APA (7th ed.) Citation

B.K, W., C.C, Y., P.L, E., B.K, Y., & 36992192300. (2023). Process optimization approach in fine pitch Cu wire bonding.

Chicago Style (17th ed.) Citation

B.K, Wong, Yong C.C, Eu P.L, Yap B.K, and 36992192300. Process Optimization Approach in Fine Pitch Cu Wire Bonding. 2023.

MLA (9th ed.) Citation

B.K, Wong, et al. Process Optimization Approach in Fine Pitch Cu Wire Bonding. 2023.

Warning: These citations may not always be 100% accurate.