APA (7th ed.) Citation

W.B, K., E.P, L., C.C, Y., O.X, Y., Y.B, K., & 36992192300. (2023). Improvement of Cu-Al bond integrity on low k pad structures.

Chicago Style (17th ed.) Citation

W.B, Kid, Leng E.P, Yong C.C, Yi O.X, Kar Y.B, and 36992192300. Improvement of Cu-Al Bond Integrity on Low K Pad Structures. 2023.

MLA (9th ed.) Citation

W.B, Kid, et al. Improvement of Cu-Al Bond Integrity on Low K Pad Structures. 2023.