APA (7th ed.) Citation

Y.B, K., N.A, T., Z, S., F.C, S., T.C, Y., V, R., & 26649255900. (2023). Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology.

Chicago Style (17th ed.) Citation

Y.B, Kar, Talik N.A, Sauli Z, Seng F.C, Yong T.C, Retnasamy V, and 26649255900. Ionic Contaminations Level and Cleaning Flip Chip BGA Package via a New Cleaning Solvent Technology. 2023.

MLA (9th ed.) Citation

Y.B, Kar, et al. Ionic Contaminations Level and Cleaning Flip Chip BGA Package via a New Cleaning Solvent Technology. 2023.