APA (7th ed.) Citation

N.A, M., B.H, B., I, A., A, I., & 26531512000. (2023). Effect of reflow soldering process on metallurgical bonding between Sn3.5Ag solder and ENIG substrates.

Chicago Style (17th ed.) Citation

N.A, Muhammad, Bais B.H, Ahmad I, Isnin A, and 26531512000. Effect of Reflow Soldering Process on Metallurgical Bonding Between Sn3.5Ag Solder and ENIG Substrates. 2023.

MLA (9th ed.) Citation

N.A, Muhammad, et al. Effect of Reflow Soldering Process on Metallurgical Bonding Between Sn3.5Ag Solder and ENIG Substrates. 2023.