APA (7th ed.) Citation

Y.B, K., T.C, H., Agileswari, C, L., & 26649255900. (2023). Solder ball robustness study on polymer core solder balls for BGA packages.

Chicago Style (17th ed.) Citation

Y.B, Kar, Hui T.C, Agileswari, Lo C, and 26649255900. Solder Ball Robustness Study on Polymer Core Solder Balls for BGA Packages. 2023.

MLA (9th ed.) Citation

Y.B, Kar, et al. Solder Ball Robustness Study on Polymer Core Solder Balls for BGA Packages. 2023.