Role of alternating current shape on microstructure and damage evolution of solder joints
Degradation; Mechanical properties; AC currents; Alternating current; Degradation of mechanical properties; Electronic package; Electronic systems; Micro-structural characterization; Solder joints; Thermal fluctuations; Electric impedance measurement
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| Main Authors: | , , , , |
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| Format: | Article |
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Elsevier Ltd
2023
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