APA (7th ed.) Citation

K.W, S., K.Y, Y., C, L., & 35796107300. (2023). Single & multi beam laser grooving process parameter development and die strength characterization for 40nm node low-K/ULK wafer. Institute of Electrical and Electronics Engineers Inc.

Chicago Style (17th ed.) Citation

K.W, Shi, Yow K.Y, Lo C, and 35796107300. Single & Multi Beam Laser Grooving Process Parameter Development and Die Strength Characterization for 40nm Node Low-K/ULK Wafer. Institute of Electrical and Electronics Engineers Inc, 2023.

MLA (9th ed.) Citation

K.W, Shi, et al. Single & Multi Beam Laser Grooving Process Parameter Development and Die Strength Characterization for 40nm Node Low-K/ULK Wafer. Institute of Electrical and Electronics Engineers Inc, 2023.