APA (7th ed.) Citation

L, H., Y, B., T.C, Y., N, K., M.R, I., L.C, T., & 56535329100. (2023). Manufacturability readiness of insulated Cu wire bonding process in PBGA package. Institute of Electrical and Electronics Engineers Inc.

Chicago Style (17th ed.) Citation

L, Hungyang, Boonkar Y, Yong T.C, Khan N, Ibrahim M.R, Tan L.C, and 56535329100. Manufacturability Readiness of Insulated Cu Wire Bonding Process in PBGA Package. Institute of Electrical and Electronics Engineers Inc, 2023.

MLA (9th ed.) Citation

L, Hungyang, et al. Manufacturability Readiness of Insulated Cu Wire Bonding Process in PBGA Package. Institute of Electrical and Electronics Engineers Inc, 2023.