Numerical investigation of heat transfer of twelve plastic leaded chip carrier (PLCC) by using computational fluid dynamic, FLUENT TM software

Plastic Leaded Chip Carrier (PLCC) package has been emerged a promising option to tackle the thermal management issue of micro-electronic devices. In the present study, three dimensional numerical analysis of heat and fluid flow through PLCC packages oriented in-line and mounted horizontally on a pr...

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Bibliographic Details

Main Authors:	Mazlan Mohamed, A.Rahim, Muhamad Iqbal Ahmad, Abdullah Mohd Mustafa Al Bakri, Razak Wahab, H.M Nor Hakim
Format:	Non-Indexed Article
Published:	Trans-Tech Publication 2013
Online Access:	http://discol.umk.edu.my/id/eprint/7870/ http://dx.doi.org/10.4028/www.scientific.net/AMR.795.603
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