Curing characterization of pressureless sintered die attach material as leadfree salution in microelectronics packaging / Low Pui Leng
Tin-silver solder alloy is widely accepted as Pb-free alternative in power electronics. However, this solder alloy cannot meet the requirements of next generation industrial and automotive power drive systems. With the ever-increasing demand for wide bandgap semiconductors with junction temperature...
Saved in:
| Main Author: | |
|---|---|
| Format: | Thesis |
| Published: |
2019
|
| Subjects: | |
| Online Access: | http://studentsrepo.um.edu.my/11482/1/Low_Pui_Leng.jpg http://studentsrepo.um.edu.my/11482/6/pui_leng.pdf http://studentsrepo.um.edu.my/11482/ |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
