Uniformity improvement by integrated electrochemical-plating process for CMOS logic technologies

Reliability of metal interconnects and the integration of inspection and metrology with process tools are advancing rapidly to overcome obstacles in down stream production. A significant drawback associated with metal interconnects which has resulted from the recent trend is the difficulty in obtain...

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Main Authors:	Wahab, Yasmin Abdul, Fadzil, Anuar, Soin, Norhayati, Fatmadiana, Sharifah, Chowdhury, Zaira Zaman, Hamizi, Nor Aliya, Pivehzhani, Omid Akbarzadeh, Sabapathy, Thennarasan, Al-Douri, Yarub
Format:	Article
Published:	Elsevier 2019
Subjects:	TK Electrical engineering. Electronics Nuclear engineering
Online Access:	http://eprints.um.edu.my/24257/ https://doi.org/10.1016/j.jmapro.2019.01.025
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