Three dimensional analysis using finite volume based CFD simulation to determine junction temperature on electronic components / Mazlan Mohamed, Rahim Atan and Mohd Zulkifly Abdullah

This paper presents the simulation of three dimensional numerical analysis of heat and fluid flow through chip package.

Bibliographic Details

Main Authors:	Mohamed, Mazlan, Atan, Rahim, Abdullah, Mohd Zulkifly
Format:	Article
Language:	en
Published:	Universiti Teknologi MARA Pulau Pinang 2011
Subjects:	Heat
Online Access:	https://ir.uitm.edu.my/id/eprint/8790/1/MAZLAN%20MOHAMED.pdf https://ir.uitm.edu.my/id/eprint/8790/
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