Employing hypersingular integral equations to obtain stress intensity factor for two slanted cracks in thermoelectric bonded materials
This research focuses on solving hypersingular integral equations (HSIEs) numerically for hermoelectric bonded materials (TEBM) subjected to shear stress and weakened by two slanted cracks. The modified complex variable function (MCVF) method is applied, integrating continuity conditions (CC) for bo...
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| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | en |
| Published: |
Penerbit Universiti Kebangsaan Malaysia
2025
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| Online Access: | http://journalarticle.ukm.my/26424/1/Paper_10%20-.pdf http://journalarticle.ukm.my/26424/ https://www.ukm.my/jqma/ |
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