Determination of thermal expansion coefficient for ball grid array using digital image correlation

This paper presents the analysis of coefficient of thermal expansion (CTE) of solder ball on a ball grid array (BGA) through digital image correlation (DIC) technique. The assessment of thermal mechanical properties of semiconductor component is a main challenge due to the sensitivity of micro-scale...

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Bibliographic Details

Main Authors:	Kong, Yat Sheng, Crosbie, Liam
Format:	Article
Language:	en
Published:	Penerbit Universiti Kebangsaan Malaysia 2022
Online Access:	http://journalarticle.ukm.my/20039/1/06.pdf http://journalarticle.ukm.my/20039/ https://www.ukm.my/jkukm/volume-3403-2022/
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