Search Results - Yap B.K.
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Stitch bond strength study in insulated Cu wire bonding by Leong, H.Y., Yap, B.K., Khan, N., Ibrahim, M.R., Tan, L.C., Faiz, M.
Published 2014Get full text
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Characterisation of insulated Cu wire ball bonding by Leong, H.Y., Yap, B.K., Khan, N., Ibrahim, M.R., Tan, L.C., Faiz, M.
Published 2014Get full text
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The effect of heat treatment time on the formation of forsterite (Mg2SiO4) by Tan, Y.M., Tan, C.Y., Singh, R., Teh, Y.C., Yap, B.K.
Published 2015Get full text
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Development of insulated cu wire stitch bonding by Leong, H.Y., Yap, B.K., Navas, K., Mohd Rusli, I., Tan, L.C., Faiz, M.
Published 2013Get full text
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The effects of sintering behavior of zirconia dopedhydroxyapatite for clinical applications by Cheah, G.P., Tan, C.Y., Farazila, Y., Andanastuti, M., Lim, K.F., Yap, B.K.
Published 2013Get full text
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In-depth study and characterization of insulated Cu wire ball bonding by Leong, H.Y., Yap, B.K., Navas, K., Mohd Rusli, I., Tan, L.C., Muhammad, F.
Published 2013Get full text
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Enhancement of the work function of indium tin oxide by surface modification using caesium fluoride by Whitcher, T.J., Yeoh, K.H., Ng, C.Y.B., Talik, N.A., Chua, C.L., Woon, K.L., Chanlek, N., Nakajima, H., Saisopa, T., Songsiriritthigul, P., Oswald, S., Yap, B.K.
Published 2013Get full text
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Effects of two-step sintering on the properties of hydroxyapatite bioceramic by Ramesh S., Gan C.J., Bang L.T., Niakan A., Tan C.Y., Purbolaksono J., Chandran H., Ramesh S., Yap B.K., Teng W.D.
Published 2023Article -
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Review on Y6-Based Semiconductor Materials and Their Future Development via Machine Learning by Zhong S., Yap B.K., Zhong Z., Ying L.
Published 2023Review -
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Space-Charge-Limited Dark Injection (SCL DI) transient measurements by Yap B.K., Koh S.P., Tiong S.K., Ong C.N.
Published 2023Conference paper
