Search Results - Tan, L.C.

Stitch bond strength study in insulated Cu wire bonding by Leong, H.Y., Yap, B.K., Khan, N., Ibrahim, M.R., Tan, L.C., Faiz, M.

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Characterisation of insulated Cu wire ball bonding by Leong, H.Y., Yap, B.K., Khan, N., Ibrahim, M.R., Tan, L.C., Faiz, M.

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Development of insulated cu wire stitch bonding by Leong, H.Y., Yap, B.K., Navas, K., Mohd Rusli, I., Tan, L.C., Faiz, M.

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Conceptual design and prototype of smart calling system research by Karuppiah, Karmegam, Krishnan, G. Mohana, Tamilmoli, L., Chan, H. B., Sinn, W. K., Lam, K. Y., Tan, L. C., Seetha, P.

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In-depth study and characterization of insulated Cu wire ball bonding by Leong, H.Y., Yap, B.K., Navas, K., Mohd Rusli, I., Tan, L.C., Muhammad, F.

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Biomechanical analysis of patient-specific femur model of osteogenesis imperfecta with cortical and cancellous bone by Tan, L. C., Mat Som, Mohd Hanafi, Basarudin, Khairul Salleh, Yazid, Haniza, Daud, Ruslizam, Awang, Mohamed Saufi

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Association of HLA locus variant in Parkinson's disease by Zhao, Y., Gopalai, A.A., Ahmad-Annuar, A., Teng, E.W.L., Prakash, K.M., Tan, L.C.S., Au, W.L., Li, H.H., Lim, Shen Yang, Lim, Soo Kun, Chong, Yip Boon, Tan, Li Ping, Ibrahim, N.M., Tan, E.K.

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Modelling of patient-specific femur with osteogenesis imperfecta to determine the fracture risk under various loads by Tan, L.C., Mat Som, Mohd Hanafi, Basaruddin, K.S., Yazid, H., Sulaiman, Abdul Razak, Awang, Mohd Shukrimi

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Insulated Cu wire free air ball characterization by Leong H., Yap B., Khan N., Ibrahim M.R., Tan L.C.

Stitch bond strength study in insulated Cu wire bonding by Leong H.Y., Yap B.K., Khan N., Ibrahim M.R., Tan L.C., Faiz M.

Characterisation of insulated Cu wire ball bonding by Leong H.Y., Yap B.K., Khan N., Ibrahim M.R., Tan L.C., Faiz M.

Manufacturability readiness of insulated Cu wire bonding process in PBGA package by Hungyang L., Boonkar Y., Yong T.C., Khan N., Ibrahim M.R., Tan L.C.

Development of insulated Cu wire ball bonding by Leong H.Y., Mohd F.Z., Ibrahim M.R., Kid W.B., Khan N., Kar Y.B., Tan L.C.