Search Results - Seng F.C.

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  1. 1
    Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology

    Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology by Kar Y.B., Talik N.A., Sauli Z., Seng F.C., Yong T.C., Retnasamy V.

    Published 2023
    Article
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  2. 2
    A practical investigation on nickel plated copper heat spreader with different catalytic activation processes for flip-chip ball grid array packages

    A practical investigation on nickel plated copper heat spreader with different catalytic activation processes for flip-chip ball grid array packages by Amin N., Lim V., Seng F.C., Razid R., Ahmad I.

    Published 2023
    Article
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  3. 3
    Characterization of nickel plated copper heat spreaders with different catalytic activation processes for flip-chip ball grid array package

    Characterization of nickel plated copper heat spreaders with different catalytic activation processes for flip-chip ball grid array package by Lim V., Ahmad I., Seng F.C., Amin N., Rasid R.

    Published 2023
    Conference Paper
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