Search Results - Sauli Z.

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    Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology

    Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology by Kar Y.B., Talik N.A., Sauli Z., Seng F.C., Yong T.C., Retnasamy V.

    Published 2023
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  2. 2
    Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS

    Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS by Kar Y.B., Talik N.A., Sauli Z., Fei J.S., Retnasamy V.

    Published 2023
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