Search Results - Saad, Abdullah Aziz

Reliability Assessment Of Self-Alignment Assemblies Of Chip Component After Reflow Soldering Process by Ali Mokhtar, Mohd Najib, Abdullah, Mohd Zulkifly, Saad, Abdullah Aziz, Che Ani, Fakhrozi, Samsudin, Zambri

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Soldering Characteristics And Thermomechanical Properties Of Pb-Free Solder Paste For Reflow Soldering by Ali Mokhtar, Mohd Najib, Mohammed Zulkifly, Abdullah, Saad, Abdullah Aziz, Che Ani, Fakhrozi, Samsudin, Zambri

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Numerical Simulation Of Self-Alignment Of Chip Resistor Components For Different Silver Content During Reflow Soldering by Abdullah, Mohd Zulkifly, Ali Mokhtar, Mohd Najib, Saad, Abdullah Aziz, Samsudin, Zambri, Che Ani, Fakhrozi

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Thermal characterization of silver-based conductive polymers for flexible electronics / Zuraihana Bachok ... [et al.] by Bachok, Zuraihana, Saad, Abdullah Aziz, Zulfiqar, Sana, Abas, Aizat, Marzuki, Marina

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