Search Results - Mock K.

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    C45 ultra low k wafer technology with Cu wire bonding

    C45 ultra low k wafer technology with Cu wire bonding by Leng E.P., Siong C.T., Seong L.B., Leong P., Gunasekaran, Song J., Mock K., Siew C., Sivakumar, Kid W.B., Weily C.

    Published 2023
    Conference Paper
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  2. 2
    Ultra fine pitch Cu wire bonding on C45 ultra low k wafer technology

    Ultra fine pitch Cu wire bonding on C45 ultra low k wafer technology by Leng E.P., Siong C.T., Seong L.B., Leong P., Gunasekaran, Song J., Mock K.S., Siew C.W., Sivakumar, Kid W.B., Weily C.

    Published 2023
    Conference paper
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