Search Results - Loh, W.K.

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  1. 1
    Progressive damage in Sn-4Ag-0.5Cu solder joints during flexural fatigue of a BGA package

    Progressive damage in Sn-4Ag-0.5Cu solder joints during flexural fatigue of a BGA package by Shaffiar, Norhashimah, Loh, W.K., Kamsah, N.

    Published 2010
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  2. 2
    Continuum damage evolution in pb-free solder joint under shear fatigue loadings

    Continuum damage evolution in pb-free solder joint under shear fatigue loadings by Shaffiar, Norhashimah, Loh, W.K., Kamsah, N., Tamin, M.N.

    Published 2010
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  3. 3
    Extended cohesive zone model for simulation of solder/IMC interface cyclic damage process in pb-free solder interconnects

    Extended cohesive zone model for simulation of solder/IMC interface cyclic damage process in pb-free solder interconnects by Yamin, A.F.M., Shaffiar, N.M., Loh, W.K., Tamin, M.N.

    Published 2012
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  4. 4
    Fatigue failure processes in pb-free solder joints using continuum damage and cohesive zone models

    Fatigue failure processes in pb-free solder joints using continuum damage and cohesive zone models by Shaffiar, Norhashimah, Yamin, A.F.M., Loh, W.K., Tamin, M.N.

    Published 2012
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  5. 5
    Damage progression in BGA solder joints during board-level drop test

    Damage progression in BGA solder joints during board-level drop test by Yamin, A.F.M., Shaffiar, Norhashimah, Loh, W.K., Tamin, M.N.

    Published 2011
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  6. 6
    Solder joint fatigue in a surface mount assembly subjected to mechanical loading

    Solder joint fatigue in a surface mount assembly subjected to mechanical loading by Tamin, M. N., Liew, Y. B., Wagiman, A. N. R., Loh, W. K.

    Published 2007
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