Search Results - Leng E.P.
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C45 ultra low k wafer technology with Cu wire bonding by Leng E.P., Siong C.T., Seong L.B., Leong P., Gunasekaran, Song J., Mock K., Siew C., Sivakumar, Kid W.B., Weily C.
Published 2023Conference Paper -
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Metallurgical bond integrity of C45 ultra fine pitch with 18m copper wire by Kid W.B., Leng E.P., Seong L.B., Weily C., Kar Y.B.
Published 2023Conference paper -
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Ultra fine pitch Cu wire bonding on C45 ultra low k wafer technology by Leng E.P., Siong C.T., Seong L.B., Leong P., Gunasekaran, Song J., Mock K.S., Siew C.W., Sivakumar, Kid W.B., Weily C.
Published 2023Conference paper
