Search Results - Leng E.P.

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  1. 1
    C45 ultra low k wafer technology with Cu wire bonding

    C45 ultra low k wafer technology with Cu wire bonding by Leng E.P., Siong C.T., Seong L.B., Leong P., Gunasekaran, Song J., Mock K., Siew C., Sivakumar, Kid W.B., Weily C.

    Published 2023
    Conference Paper
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  2. 2
    Improvement of Cu-Al bond integrity on low k pad structures

    Improvement of Cu-Al bond integrity on low k pad structures by Kid W.B., Leng E.P., Yong C.C., Yi O.X., Kar Y.B.

    Published 2023
    Conference paper
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  3. 3
    Metallurgical bond integrity of C45 ultra fine pitch with 18m copper wire

    Metallurgical bond integrity of C45 ultra fine pitch with 18m copper wire by Kid W.B., Leng E.P., Seong L.B., Weily C., Kar Y.B.

    Published 2023
    Conference paper
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  4. 4
    Ultra fine pitch Cu wire bonding on C45 ultra low k wafer technology

    Ultra fine pitch Cu wire bonding on C45 ultra low k wafer technology by Leng E.P., Siong C.T., Seong L.B., Leong P., Gunasekaran, Song J., Mock K.S., Siew C.W., Sivakumar, Kid W.B., Weily C.

    Published 2023
    Conference paper
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