Search Results - Isnin A.

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  1. 1
    Intermetallic growth of Sn-Ag-Sb/Ni plated Cu in power packaging subject to thermal aging

    Intermetallic growth of Sn-Ag-Sb/Ni plated Cu in power packaging subject to thermal aging by Shualdi W., Ahmad I., Omar G., Isnin A.

    Published 2023
    Conference paper
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  2. 2
    Effect of reflow soldering process on metallurgical bonding between Sn3.5Ag solder and ENIG substrates

    Effect of reflow soldering process on metallurgical bonding between Sn3.5Ag solder and ENIG substrates by Muhammad N.A., Bais B.H., Ahmad I., Isnin A.

    Published 2023
    Conference paper
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  3. 3
    Nanoindentation characterization of Sn-Ag-Sb/Cu substrate IMC Layer subject to thermal aging

    Nanoindentation characterization of Sn-Ag-Sb/Cu substrate IMC Layer subject to thermal aging by Shualdi W., Bais B., Ahmad I., Omar G., Isnin A.

    Published 2023
    Conference paper
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