Search Results - Cheah A.Y.

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  1. 1
    The effect of clean and no-clean flux in enhancing the wettability of eutectic solder bump flip chip PBGA

    The effect of clean and no-clean flux in enhancing the wettability of eutectic solder bump flip chip PBGA by Amin N., Cheah A.Y., Kornain Z., Ahmad I.

    Published 2023
    Conference paper
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  2. 2
    Effect of treated silver nanoparticles to electrical conductivity improvement of electrically conductive adhesive (ECA)

    Effect of treated silver nanoparticles to electrical conductivity improvement of electrically conductive adhesive (ECA) by Kornain Z., Amin N., Jalar A., Cheah A.Y., Ahmad I.

    Published 2023
    Conference paper
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