Search Results - Che Ani, Fakhrozi

Reliability Assessment Of Self-Alignment Assemblies Of Chip Component After Reflow Soldering Process by Ali Mokhtar, Mohd Najib, Abdullah, Mohd Zulkifly, Saad, Abdullah Aziz, Che Ani, Fakhrozi, Samsudin, Zambri

Get full text
Get full text

Soldering Characteristics And Thermomechanical Properties Of Pb-Free Solder Paste For Reflow Soldering by Ali Mokhtar, Mohd Najib, Mohammed Zulkifly, Abdullah, Saad, Abdullah Aziz, Che Ani, Fakhrozi, Samsudin, Zambri

Get full text
Get full text
Get full text

Numerical Simulation Of Self-Alignment Of Chip Resistor Components For Different Silver Content During Reflow Soldering by Abdullah, Mohd Zulkifly, Ali Mokhtar, Mohd Najib, Saad, Abdullah Aziz, Samsudin, Zambri, Che Ani, Fakhrozi

Get full text
Get full text
Get full text

Hydrophobicity Performance Of Polyethylene Terephthalate (PET) And Thermoplastic Polyurethane (TPU) With Thermal Effect by Jasmee, Solehah, Omar, Ghazali, Masripan, Nor Azmmi, Kamarolzaman, Anita Akmar, A S Ashikin, Che Ani, Fakhrozi

Get full text
Get full text
Get full text

Thermo-Mechanical And Adhesion Performance Of Silver-Filled Conductive Polymer Composite (SFCP) Using Thermoplastic Polyurethane (TPU) Substrate by Omar, Ghazali, A Hamid, Husna, Azli, Siti Ashikin, Jasmee, Solehah, Jalar, Azman, Tamaldin, Noreffendy, Che Ani, Fakhrozi

Get full text
Get full text
Get full text